Support for innovation and Research partnerships

Grants for carrying out mainly dissemination activities aimed at promoting the responsible research and innovation leading to achieve R&D&I results in line with values, needs and expectations of European society.

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The Joint Technology Initiative on Electronic Components and Systems for European Leadership, which replace and succeed the ENIAC and ARTEMIS Initiatives, is a new Public-Private Partnership between the European Commission, the countries participating in Framework Programme Horizon 2020 on a voluntary basis and three associations (EPoSS, AENEAS and ARTEMIS Industry Association) representing the actors from the areas of micro- and nano-electronics, smart integrated systems and embedded/cyber-physical systems. This initiative in electronic components and systems, aiming at bridging the gap between research and exploitation, aligning strategies to increase European and national investments and building an advanced ecosystem, will run from 2014 to 2024 and its total budget is € 4,012,374,000, of which the EU will contribute with up to € 1,184,874,000 from Horizon 2020, ECSEL Participating States shall make a financial contribution of, at least, € 1,170 million and ECSEL private members shall contribute with, at least, € 1,657,500,000.

The objectives of the initiative are to:
* contribute to the development of a strong and globally competitive electronics components and systems industry in the European Union;
* ensure the availability of electronic components and systems for key markets and for addressing societal challenges, keeping Europe at the forefront of technology development, bridging the gap between research and exploitation, strengthening innovation capabilities and creating economic and employment growth in the Union;
* align strategies with Member States to attract private investment;
* maintain and grow semiconductor and smart system manufacturing capability in Europe;
* secure and strengthen a commanding position in design and systems engineering;
* provide access for all stakeholders to a world-class infrastructure for design and manufacturing;
* build a dynamic ecosystem involving Small and Medium-Sized Enterprises (SMEs), strengthening existing clusters and creating new clusters.

The programme’s structure defined in its Multi-annual work plan include :
* Key Applications (Part A), including: Smart Mobility; Smart Society; Smart Energy; Smart Health and Smart production
* Essential technologies (Part B), including: Semiconductor Process, Equipment and Materials; Design Technology; Cyber-physical Systems; and Smart Systems Integration

The initiative will be implemented through: Research and Innovation Actions (R&IA); Innovation Actions (IA, including Pilot lines and test beds and Demonstrators, innovation pilot projects and zones of full-scale testing); KETs/ multiKETs; Excellence and competence centres; and Innovation support actions.